Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy
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Properties\Grade
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CuNi1
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CuNi2
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CuNi6
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CuNi8
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CuMn3
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CuNi10
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Main Chemical Composition
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Ni
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1
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2
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6
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8
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_
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10
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Mn
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_
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_
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_
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_
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3
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_
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Cu
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Bal
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Bal
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Bal
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Bal
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Bal
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Bal
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Max Continuous Service Temperature(oC)
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200
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200
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200
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250
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200
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250
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Resisivity at 20oC (Ωmm2/m)
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0.03
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0.05
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0.10
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0.12
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0.12
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0.15
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Density(g/cm3)
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8.9
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8.9
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8.9
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8.9
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8.8
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8.9
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Thermal Conductivity(α×10-6/oC)
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<100
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<120
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<60
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<57
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<38
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<50
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Tensile Strength(Mpa)
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≥210
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≥220
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≥250
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≥270
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≥290
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≥290
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EMF vs Cu(μV/oC)(0~100oC)
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-8
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-12
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-12
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-22
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_
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-25
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Approximate Melting Point( oC)
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1085
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1090
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1095
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1097
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1050
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1100
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Micrographic Structure
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austenite
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austenite
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austenite
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austenite
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austenite
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austenite
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Magnetic Property
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non
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non
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non
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non
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non
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non
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Properties\Grade
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CuNi14
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CuNi19
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CuNi23
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CuNi30
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CuNi34
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CuNi44
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Main Chemical Composition
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Ni
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14
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19
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23
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30
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34
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44
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Mn
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0.3
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0.5
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0.5
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1.0
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1.0
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1.0
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Cu
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Bal
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Bal
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Bal
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Bal
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Bal
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Bal
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Max Continuous Service Temperature(oC)
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300
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300
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300
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350
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350
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400
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Resisivity at 20oC (Ωmm2/m)
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0.20
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0.25
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0.30
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0.35
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0.40
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0.49
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Density(g/cm3)
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8.9
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8.9
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8.9
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8.9
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8.9
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8.9
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Thermal Conductivity(α×10-6/oC)
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<30
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<25
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<16
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<10
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<0
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<-6
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Tensile Strength(Mpa)
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≥310
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≥340
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≥350
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≥400
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≥400
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≥420
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EMF vs Cu(μV/oC)(0~100oC)
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-28
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-32
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-34
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-37
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-39
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-43
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Approximate Melting Point( oC)
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1115
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1135
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1150
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1170
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1180
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1280
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Micrographic Structure
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austenite
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austenite
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austenite
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austenite
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austenite
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austenite
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Magnetic Property
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non
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non
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non
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non
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non
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non
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