Key Specifications: | |
Application: | Pb-free PCBA for medical,industrial,automotive and other electrical products. |
PCB Board assembly | SMT & PTH & BGA &DIP |
PCB material | FR-4, FR-4 High ,HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
Layer: | 1 to 20 layers PCB layout, fabrication, PCB assembly and casing/chassis design PCBA |
PCBA service | Components sourcing and purchasing |
Quick prototyping | |
Plastic injection molding | |
Metal sheet stamping | |
Box building. | |
Test: |
AOI, In-Circuit Test (ICT), Functional Test (FCT),X-ray Test( for BGA), Conformal coating test, Aging test,
IC pre-programming / Burning on-line |
Custom clearance for material importing and product exporting |
Capacity | |
SMT | Lines : 9(5 Yamaha,4 KME) |
Capacity: 52 million placements per month | |
Max Board Size: 457*356mm.(18"X14") | |
Min Component size 01015. 4 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP | |
Min.pin space of IC 0.3mm | |
Max.precision of IC assembly ±0.03mm | |
Min. space of BGA 0.3mm | |
Speed 0.15 sec/chip,0.7 sec/QFP | |
Max board width 400 mm | |
DIP | Type Dual wave |
Pbs status Lead-free line support | |
Max temp 399 degree C | |
Spray flux add-on | |
Pre-heat 3 | |
DIP capacity ≥100k parts/day | |
Assembly | electronic product final assembly 100k/month |