Grade | Telcon200 |
High expansion layer | Mn75Ni15Cu10 |
Low expansion layer | Ni36 |
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Ni36 | ≤0.05 | ≤0.3 | ≤0.6 | ≤0.02 | ≤0.02 | 35~37 | - | - | Bal. |
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Mn72Ni10Cu18 | ≤0.05 | ≤0.5 | Bal. | ≤0.02 | ≤0.02 | 9~11 | - | 17~19 | ≤0.8 |
Density (g/cm3) | 7.7 |
Electrical resistivity at 20 ºC (ohm mm 2 /m) | 1.13 ±5% |
Thermal conductivity, λ/ W/(m* ºC ) | 6 |
Elastic Modulus, E/ Gpa | 113~142 |
Bending K / 10 -6 ºC -1 (20~135 ºC ) | 20.8 |
Temperature bending rate F/ ( 20~130 ºC ) 10 -6 ºC -1 | 39.0%±5% |
Allowable temperature ( ºC ) | -70~ 200 |
Linear temperature ( ºC ) | -20~ 150 |
Alloys Name | Type | Dimension | ||
Telcon200 | Strip | W= 5~120mm | T= 0.1mm |