Full Size Porcelain Insulating Plate 96% Al2O3 Alumina Ceramic Substrate

Model NO.
JJBP-0111-0003
Density
Over 3.70g/cm3
Standard Thickness
0.1-2.0mm Available
Thickness Tolerance
±0.03/0.05mm (Depending on Thickness)
Length and Width Tolerance
±2mm
Customized Service
OEM, ODM, Prototyping, Trial Order Supported
Transport Package
Individual Package
Specification
Max. up to 500mm x 500mm
Trademark
JingHui
Origin
China
HS Code
8547100000
Reference Price
$ 4.50 - 9.00
Contact Us

Product Description

Full Size Porcelain Insulating Plate 96% Al2O3 Alumina Ceramic Substrate
Full Size Porcelain Insulating Plate 96% Al2O3 Alumina Ceramic Substrate
 

Product Introduction

1. 96% Alumina (Al2O3) is one of the most popular ceramic substrate materials because of its excellent  heat resistance , high  mechanical strength ,  abrasion resistance , and  small   dielectric loss . The surface of the alumina ceramic substrate is quite  smooth  and has a low porosity.


2. 96% Alumina substrates are suitable for  thick film applications  like hybrid PCB and component substrates or it can be used in  direct plated copper  sputtering.

3. Thanks to its adequate thermal conductivity, it can also be used as a   heat spreader   at the back of a PCB. It is also suitable for usage in   high power and high-frequency applications   because of dielectric properties.
 

Full Size Porcelain Insulating Plate 96% Al2O3 Alumina Ceramic Substrate
Product Parameters
 
Alumina Ceramic Substrate
Item Unit 96% Al2O3
Mechanical   Properties
Color / / White
Density Drainage Method g/cm 3 ≥ 3.70
Light Reflectivity 400nm/1mm % 94
Flexural Strength Three   P oint   Bending MPa >350
Fracture Toughness Indentation Method MPa · m 1/2 3.0
Vickers Hardness Load 4.9N GPa 14
Young's Modulus Stretching Method GPa 340
Water Absorption    % 0
Camber / Length‰ T≤ 0.3:   ≤ 5 ‰ , Others:   ≤3‰
Thermal   Properties
Max. Service Temperature (Non-loading) / ºC 1200
CTE (Coefficient of
Thermal Expansion) 		20-800ºC 1×10 -6 /ºC 7.8
Thermal Conductivity 25ºC W/m·K >24
Thermal Shock Resistance 800ºC ≥ 10 Times No Crack
Specific Heat 25ºC J/kg · k 750
Electrical   Properties
Dielectric Constant 25ºC, 1MHz / 9.4
Dielectric Loss Angle 25ºC, 1MHz ×10 -4 ≤3
Volume Resistivity 25ºC Ω · cm ≥ 10 14
Dielectric Strength DC KV/mm ≥ 15

Manufacturing Capacity

Products of various specifications can be produced . The table   below  shows our   standard   thicknesses and sizes.

Alumina Ceramic Substrate
96% Al2O3
Thickness   (mm) Maximum S ize (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.25 120 114.3 114.3   √   Tape Casting
0.3 120 114.3 114.3   √   Tape Casting
0.38 140×190     √     Tape Casting
0.5 140×190     √     Tape Casting
0.635 140×190     √     Tape Casting
0.76 130 ×1 40     √     Tape Casting
0.8 130 ×1 40     √     Tape Casting
0.89 130 ×1 40     √     Tape Casting
1 280× 240     √     Tape Casting
1.5 165× 210     √     Tape Casting
2 500× 500     √     Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

Product Recommendations

Beside bare ceramic substrates, we also manufacture metallized ceramic PCBs. Metallized ceramics is one of our advantageous products.
 

 
Full Size Porcelain Insulating Plate 96% Al2O3 Alumina Ceramic Substrate
Full Size Porcelain Insulating Plate 96% Al2O3 Alumina Ceramic Substrate

 

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