Areas of Application
• Suitable for bonding of parquet flooring,laminate flooring and solid wood flooring with concrete,
• Suitable for bonding with facing board and cardboard in room.
Product Features
• No formaldehyde,dissociate TDI and solvent,no volatile hazardous materials during the process of curing.
• No damage to the floor.
• One-component,excellent extrudability,no sag,easy constructiong.
• Good elasticity and sound insulation.
Technical date
Items |
Lejell230 |
|
Scope |
Typical value |
|
Appearance |
Ochre, Uniform paste |
Ochre |
Extrudability (ml/min) GB/T 13477.4 |
≥100 |
150 |
Sagging properties(mm) GB/T 13477.6 |
0 |
0 |
Tack free time(min) GB/T 13477.5 |
1~3 |
2 |
Tensile strength(MPa) GB/T 528 |
≥1.0 |
1.2 |
Elongation at break(%) GB/T 528 |
≥400 |
450 |
Operating temperature(ºC) |
-40~90 |
Direction for use = 1 \* GB3 All data above were tested under standardized condition at 23±2ºC.50±5%RH.