Plate Laser Cutting Equipment

Model NO.
CG13025
Structure Type
Gantry Type
Laser Classification
Solid Laser
Laser Technology
Laser Control Fault Cutting
Laser Power
3000W -30000W
Working Area
6000*2500mm/12000*2500mm
Laser Source
Ipg/Max/Raycus
Position Accuracy
0.03mm
Max Moving Speed
100m/Min
Min Line Width
0.1nm
Laser Source Brand
Raycus /Max/Ipg(Optional )
Servo Motor Brand
Yaskawa
Laser Head Brand
Raytools/Precitec
Control System Brand
Cypcut
Transport Package
Standard Wooden Box
Specification
7200mm × 3700mm × 2000mm
Trademark
Laser cutting equipment
Origin
Shandong, China
HS Code
8456110090
Production Capacity
100 Set / Month
Reference Price
$ 13,500.00 - 180,000.00
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Product Description

Plate Laser Cutting Equipment Plate Laser Cutting Equipment Plate Laser Cutting Equipment Plate Laser Cutting Equipment Plate Laser Cutting Equipment Plate Laser Cutting Equipment Plate Laser Cutting Equipment
Effective Cutting Area 3000*12000mm - 4500*20000
Accuracy ± 0.03mm
Repositioning Accuracy ± 0.02mm
Z-Axis Travel 150mm
X/Y/Z Servo Motor Yaskawa
Linear Rails HIWIN/PMI
Rack APEX
Laser Source Raycus
Laser Power 3000W - 20000W
Control System CypCut

 

Laser Cutting Machine