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1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs
. Blind/buried vias with sequential lamination . HDI build up micro via technology with solid copper filled vias . Via in pad technology with conductive and non-conductive filled vias . Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. . Special materials and hybrid construction |
FACTORY AND EQUIPMENT