Stencil Size:
|
736x736mm
|
Minimum IC Pitch:
|
0.2mm
|
Maximum PCB size:
|
1200x 500mm
|
Minimum PCB thickness:
|
0.25mm
|
Minimum chip size:
|
0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
|
Maximum BGA size:
|
74x74mm
|
BGA ball pitch:
|
1.00mm (minimum), 3.00mm (maximum)
|
BGA ball diameter:
|
0.40mm (minimum), 1.00mm (maximum)
|
QFP lead pitch:
|
0.38mm (minimum), 2.54mm (maximum)
|
Volume:
|
One piece to low volume production quantities
Low cost first article builds Schedule deliveries |
|
Surface mount(SMT) assembly
DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly |
|
Passive components:
As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
|
Turnkey(we supply the parts)
Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type:
|
Leaded
Lead-free/ROHS compliant |
Other capabilities:
|
Repair/rework services
Mechanical assembly Box build Mold and plastic injection. |